Circuitized substrate with dielectric interposer assembly and method
AssigneeEndicott Interconnect Technologies, Inc.
InventorsRabindra N. Das, John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr.
Life of this patent
Estimating the term…
Abstract
A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.
Claims10
A circuitized substrate comprising:
- a) a first printed circuit board (PCB) layer having a first plurality of conductive features, each of said conductive features having a predetermined dimension;
- b) a dielectric interposer positioned on said first PCB layer;
- c) a second PCB layer having a second plurality of conductive features further positioned on said dielectric interposer;
- and
- d) a plurality of thru-holes extending through said dielectric interposer layer, each of said plurality of thru-holes having a diameter greater than said predetermined conductive feature dimension, resulting in a pocket of space proximate said plurality of conductive features, and each of said plurality of thru-holes being in alignment with a respective one of said first and said second plurality of conductive features on said first and said second PCB layers, respectively, and including a portion of laminated, electrically resistive paste thereon, said laminated electrically resistive paste being spread outside boundaries of said plurality of conductive features to fill said pockets of space, said electrically resistive paste having an adjustable resistivity factor.
Dependencies are inferred from the claim text.