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US 8,299,369 B2Granted
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
AssigneeIntel Corporation
InventorsGary A. Brist, Gary Baxter Long, Daryl A. Sato
Life of this patent
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Abstract
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
Claims11
An apparatus, comprising:
- a plurality of conductive segments in a first plane;
- a plurality of conductive segments in a second plane;
- one or more dielectric layers separating the first plane and the second plane;
- and one or more conductive trenches coupled to the first plane, wherein a conductive trench has two side walls that are connected to a first conductive segment in the first plane and to a second conductive segment in the second plane, wherein the conductive segments in the first plane and the conductive segments in the second plane are stacked so that the conductive segments having substantially equal areas are aligned in a vertical axis for connection by at least one of the conductive trenches.
1 more element
Dependencies are inferred from the claim text.