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US 8,299,366 B2Granted
Wiring board and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsKenji Sato, Shunsuke Sakai
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AssigneeIbiden Co., Ltd.
InventorsKenji Sato, Shunsuke Sakai
Estimating the term…
A wiring board is formed with a substrate designating either the upper surface or the lower surface as a first surface and the other as a second surface; an electronic component arranged inside the substrate; and a first conductive layer formed on the first-surface side of the substrate by means of a first insulation layer made up of a first lower insulation layer and a first upper insulation layer. In such a wiring board, the first lower insulation layer and the first upper insulation layer are made of different materials from each other. Moreover, the first lower insulation layer is positioned on the first surface of the substrate and the electronic component, and the material that forms the first lower insulation layer fills a clearance between the substrate and the electronic component.
A wiring board comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
Associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]: associated with components encapsulated…
For connecting multiple chips together: the multiple chips being integrally enclosed
Characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern: initial plating of…
Manufacturing multilayer circuits: characterized by a special circuit board as base or central core whereon additional circuit layers are built or…
About 3 years 8 months of term left · ends 17 Jun 2030 (estimated)
1. Field of the Invention
The present invention is related to a wiring board with a built-in electronic component such as an IC chip and a method for manufacturing the same.
2. Discussion of the Background
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
FIG. 1 is a cross-sectional view of a wiring board according to an embodiment of the present invention;
FIG. 2 is a magnified view showing part of FIG. 1;
The embodiments will now be described with reference to the accompanying drawings, wherein like reference numerals designate corresponding or identical elements throughout the various drawings.
In the following, a wiring board and its manufacturing method according to an embodiment of the present invention are described with reference to the drawings. In the drawings, arrows (Z1, Z2) respectively indicate the directions in which to laminate the layers of a wiring board, corresponding to the directions along normal lines of the main surfaces (upper and lower surfaces) of the wiring board (or the direction of the thickness of a core substrate). Meanwhile, arrows (X1, X2) and (Y1, Y2) respectively indicate the directions perpendicular to the lamination directions (the directions parallel to the main surfaces of a wiring board). The main surfaces of a wiring board are positioned on X-Y planes. In the following, two main surfaces facing opposite lamination directions are referred to as a first surface (the surface on the arrow-Z1 side) and a second surface (the surface on the arrow-Z2 side). In addition, in each lamination direction, the side closer to a core (substrate 101) is referred to as a lower layer (or an inner layer), and the side farther away from the core is referred to as an upper layer (or an external layer).
Wiring board 10 of the present embodiment has wiring board 100 as a core substrate, electronic component 200 and external connection terminals (31b, 32b), as shown in FIG. 1. Wiring board 10 is a multilayer wiring board configured to be rectangular.