Polysiloxane composition, molded body obtained from the same, and optodevice member
AssigneeKaneka Corporation
InventorsTakao Manabe, Satoshi Sugiyama, Makoto Seino
Life of this patent
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Abstract
The present invention provides a polysiloxane composition maintaining high transparency over a wide wavelength region and a wide temperature region and being excellent in heat resistance, low-dielectric characteristics, workability, and the like. A polysiloxane composition includes (A) a polysiloxane which is composed of a polysiloxane compound having a polyhedral skeleton having 6 to 24 Si atoms in its molecule and which has at least one alkenyl group bonded directly or indirectly to a Si atom constituting the polyhedral skeleton, (B) a polysiloxane having a hydrosilyl group, and (C) a hydrosilylation catalyst.
Claims20
A method for molding a polysiloxane composition, wherein the method comprises:
- dissolving components (A) to (C) in a solvent, wherein
- the component (A) is a polysiloxane, which is composed of a polysiloxane compound having a polyhedral skeleton having 6 to 24 Si atoms in its molecule and which has at least one alkenyl group bonded directly or indirectly to a Si atom constitution the polyhedral skeleton,
- the component (B) is a polysiloxane having a hydrosilyl group, and
- the component (C) is a hydrosilylation catalyst;
- reacting a part of alkenyl groups of the component (A) and a part of hydrosilyl groups of the component (B);
- distilling off the solvent to form a liquid resin composition;
- and then
- curing the polysiloxane composition.
Dependencies are inferred from the claim text.