Organosilane polymer with improved gap-filling property for semiconductor device and coating composition using the same

A composition for gap-filling in a semiconductor device, the composition comprising:

• a polymer as represented by Formula 5:
• {(R′SiO1.5)s(HSiO1.5)t(X(CH2)pSiO1.5)u(SiO1.5(CH2)mSiO1.5)v}n (5)
• wherein:
• s, t, u, and v satisfy the relations s+t+u+v=1, 0<u, and 0<v, provided that s and t are not simultaneously zero,
• X is a C6-C12 aryl group,
• R′ is a C1-C6 alkyl group,
• p and m are independently from 0 to 2, and
• n is 1 or more;
• an organic solvent, wherein the organic solvent is present in an amount of about 100 to about 3,000 parts by weight, based on 100 parts by weight of the polymer;
• and
• a crosslinker, wherein the crosslinker includes one or more of melamine-based crosslinkers, substituted urea-based crosslinkers, epoxy-containing polymers, and derivatives thereof.