Adhesive composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMikio Shiono, Noriyuki Koike
Life of this patent
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Abstract
An adhesive composition is provided comprising (A) a fluorinated amide compound containing at least two vinyl groups and having a polyfluoro structure, (B) a fluorinated organosilicon compound containing a fluorinated organic group, at least two SiH groups, and an alkyl, aryl or aralkyl group, and (C) a platinum catalyst, and (D) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. The composition is cured on brief heating into a product which achieves adhesion to various substrates and has solvent resistance, chemical resistance, heat resistance, low-temperature properties, low moisture permeability, electric insulation, and acid resistance.
Claims2
An adhesive composition comprising
- (A) 100 parts by weight of a fluorinated amide compound having the general formula (1):
- wherein R1 is each independently vinyl or C1-C4 alkyl, R2 is each independently C1-C6 alkylene, R3 is each independently hydrogen or optionally fluorinated C1-C4 alkyl, and Rf1 is a perfluoroalkylene or divalent perfluoropolyether group,
- (B) a fluorinated organosilicon compound containing in a molecule at least one monovalent perfluoroalkyl, monovalent perfluorooxyalkyl, divalent perfluoroalkylene or divalent perfluorooxyalkylene group and at least two silicon-bonded hydrogen atoms, and further containing a silicon-bonded monovalent substituent group which is selected from unsubstituted or halo-substituted C1-C20 alkyl, aryl and aralkyl groups, in an amount to give 0.5 to 3.0 moles of SiH groups per mole of vinyl in component (A),
- (C) a catalytic amount of a platinum group compound, and
- (D) 0.1 to 10 parts by weight of an organosiloxane containing in a molecule at least one silicon-bonded hydrogen atom and at least one epoxy and/or trialkoxysilyl group bonded to a silicon atom via carbon atoms or carbon and oxygen atoms.
Dependencies are inferred from the claim text.