Volatile precursors for deposition of C-linked SiCOH dielectrics

A method of forming a low-k dielectric film on a substrate, the method comprising the steps of:

• providing a reaction chamber having at least one substrate disposed therein;
• introducing into the reaction chamber between approximately 25% and approximately 75% based on total precursor flow in mg/min of at least one precursor compound selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, allyldimethoxysilane, and 1,1-diethoxy-1-silacylopent -3-ene;
• introducing into the reaction chamber between approximately 25% and approximately 75% based on total precursor flow in mg/min of at least one porogen selected from the group consisting of BCHD and trivertal;
• contacting the at least one precursor compound and the porogen with the substrate to form the low-k dielectric film on at least one surface of the substrate using a vapor deposition process;
• and
• heating or curing the low-k dielectric film to form a low-k dielectric film with a dielectric constant below about 2.7 and a Young's modulus greater than about 4 GPa.