Back to results
US 8,298,964 B2Granted
Method and apparatus providing air-gap insulation between adjacent conductors using nanoparticles
AssigneeMicron Technology, Inc.
InventorsNishant Sinha, Gurtej Sandhu, Neil Greeley, John Smythe
Life of this patent
Estimating the term…
Abstract
A semiconductor device and a method of forming it are disclosed in which at least two adjacent conductors have an air-gap insulator between them which is covered by nanoparticles of insulating material being a size which prevent the nanoparticles from substantially entering into the air-gap.
Claims10
A method of fabricating a semiconductor device comprising:
- forming at least two adjacent co-planar conductors on a support material, the conductors defining a gap between them;
- and
- depositing a plurality of nanoparticles over the conductors and gaps, the nanoparticles having a size which causes them to bridge across the adjacent co-planar conductors.
Dependencies are inferred from the claim text.