Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits

Process for coating a composite material on areas comprising electrically conductive or semiconductive metal areas, and electrically non-conductive areas, the said process comprising at least one step of electroless growth of a metal layer plumb with the said electrically conductive or semiconductive metal areas, characterized in that the electrically non-conductive areas of the composite material are not formed from organic polymers and in that, prior to the said electroless growth step, the said process furthermore includes at least one first step of forming a nucleation layer by covalent or dative grafting of an organic or organometallic film on, and only on, the said electrically conductive or semiconductive metal areas, by bringing the said layer into contact with a solution of organic or organometallic, difunctional precursors of the following formula (I):

• A-(X)n-B (I)
• in which:
• A is a group having at least one reactive chemical function allowing the said organic precursor to be covalently and selectively attached to the surface of the said electrically conductive areas;
• X is a spacer arm covalently linked to A and to B;
• n is an integer equal to 0 or 1;
• and
• B is a group having at least one ligand function for metal ions or for metal aggregates, that is to say allowing the complexation of metal ions and/or metal aggregates.