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AssigneeATI Technologies ULC
InventorsAndrew Leung, Roden R. Topacio, Liane Martinez, Yip Seng Low
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A method of manufacturing a substrate for use in electronic packaging having a core, m buildup layers on a first surface of the core and n buildup layers on a second surface of the core, where m≠n is disclosed. The method includes forming (m−n) of the m buildup layers on the first surface, and then forming n pairs of buildup layers, with each one of the pairs including one of the n buildup layers formed on the second surface and one of the remaining n of the m buildup layers formed on the first surface. Each buildup layer includes a dielectric layer and a conductive layer formed thereon. The disclosed method protects the dielectric layer in each of buildup layers from becoming overdesmeared during substrate manufacturing by avoiding repeated desmearing of dielectric materials.
A method of manufacturing a substrate having a core, m buildup layers on a first surface of said core and n buildup layers on a second surface of said core, wherein each of said buildup layers comprises a dielectric layer, and a conductive layer thereon, and where m>n, said method comprising:
Dependencies are inferred from the claim text.