Phase change memory cell structures and methods
AssigneeMicron Technology, Inc.
InventorsTimothy A. Quick, Eugene P. Marsh, Joseph N. Greeley
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorsTimothy A. Quick, Eugene P. Marsh, Joseph N. Greeley
Estimating the term…
Phase change memory cell structures and methods are described herein. A number of methods of forming a phase change memory cell structure include forming a dielectric stack structure on a first electrode, wherein forming the dielectric stack structure includes creating a second region between a first region and a third region of the dielectric stack structure, the second region having a thermal conductivity different than a thermal conductivity of the first region and different than a thermal conductivity of the third region of the dielectric stack. One or more embodiments include forming a via through the first, second, and third regions of the dielectric stack structure, depositing a phase change material in the via, and forming a second electrode on the phase change material.
A method of forming a memory cell structure, comprising forming a dielectric stack structure on a first electrode, wherein forming the dielectric stack structure includes creating a second region between a first region and a third region of the dielectric stack structure, the second region having a thermal conductivity different than a thermal conductivity of the first region and different than a thermal conductivity of the third region of the dielectric stack;
A method of forming a memory cell structure, comprising:
A memory cell structure, comprising:
A memory cell structure, comprising:
Dependencies are inferred from the claim text.