Offset solder vias, methods of manufacturing and design structures

A method, comprising:

• forming an integrated circuit comprising an underlying metal layer in contact with an interconnect;
• forming a crescent shaped via offset from the underlying metal layer and a metal layer in direct electrical contact with the underlying metal layer, wherein an apex of the crescent shaped via is formed to be radially in alignment of a geometric center of the chip;
• and
• forming a solder bump in the crescent shaped via, such that the crescent shaped via offset moves its outboard edge farther from an outboard edge of a solder bump without moving an inboard edge much closer to an inboard edge of the solder bump.