Methods of forming wiring structures

Abstract

In a method of forming a wiring structure, a first insulation layer is formed on a substrate, the first insulation layer comprising a group of hydrocarbon (CαHβ) wherein α and β are integers. A second insulation layer is formed on the first insulation layer, the second insulation layer being avoid of the group of hydrocarbon. A first opening is formed through the first and the second insulation layers by etching the first and the second insulation layers. A damaged pattern and a first insulation layer pattern are formed by performing a surface treatment on a portion of the first insulation layer corresponding to an inner sidewall of the first opening. A sacrificial spacer is formed in the first opening on the damaged pattern and on the second insulation layer. A conductive pattern is formed in the first opening. The sacrificial spacer and the damaged pattern are removed to form a first air gap between the conductive pattern and the first insulation layer pattern, and to form a second air gap between the conductive pattern and the second insulation layer.

Dependencies are inferred from the claim text.