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US 8,298,874 B2Granted
Packaged electronic devices having die attach regions with selective thin dielectric layer
AssigneeTexas Instruments Incorporated
InventorsBernardo Gallegos, Kenji Masumoto
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Abstract
A method for forming a packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least one land pad thereon and a first dielectric layer positioned lateral to the land pad and a non-die attach region. A second dielectric layer is formed on the top substrate surface of the package substrate. An IC die which is mounted to the top substrate surface of the package substrate. An underfill layer is formed between the IC die and the die attach region.
Claims14
A method of forming a packaged electronic device, comprising:
- providing (i) a package substrate having top substrate surface including a die attach region including at least one land pad thereon and a non-die mounting region and (ii) an IC die having a top semiconductor surface including active circuitry and at least one bonding conductor formed on said top semiconductor surface and a bottom surface;
- forming a dielectric layer on said top substrate surface of said package substrate having a first thickness over said die attach region in regions lateral to said land pad and a second thickness over said non-die mounting region, wherein said second thickness>said first thickness by at least 5 μm, and
- mounting said IC die to said top substrate surface of said package substrate, and
- forming an underfill layer to fill a gap between said IC die and said top substrate surface.
1 more element
Dependencies are inferred from the claim text.