US 8,298,873 B2 · Method for producing circuit substrate, and circuit substrate

Abstract

The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.

Claims4

Dependent claims

A method for producing a circuit substrate comprising:

providing a circuit substrate sheet having an uncured layer that is curable by irradiation with active energy ray;
disposing a circuit chip on a predetermined part of said uncured layer;
thereafter embedding said circuit chip into said uncured layer;
and
irradiating with said active energy ray said circuit substrate sheet having said circuit chip embedded therein, to cure said circuit substrate sheet, for obtaining said circuit substrate having said circuit chip embedded therein, wherein:
before embedding said circuit chip into said uncured layer, a part, that is other than said predetermined part, of said uncured layer is selectively cured to be a cured portion, whereas said predetermined part is left to be an uncured portion.

3 more elements

Dependencies are inferred from the claim text.

Method for producing circuit substrate, and circuit substrate

Life of this patent

Method for producing circuit substrate, and circuit substrate

Life of this patent

Abstract

Claims4