Method and leadframe for packaging integrated circuits

A method of packaging at least two integrated circuit dice into a single integrated circuit package utilizing a single leadframe, the method comprising:

• positioning a first die onto a first side of a leadframe such that I/O pads on the first die are positioned adjacent corresponding solder pads on first sides of selected leads of the leadframe, the first die including an active surface with the I/O pads and an opposing back surface;
• reflowing solder bumps positioned between the I/O pads on the first die and the solder pads on the first sides of the leads to produce a first plurality of solder joints that physically and electrically connect the first die to the leads of the leadframe;
• flipping the leadframe;
• positioning the leadframe onto a set of spacers, wherein the set of spacers physically support the leadframe and are not in direct contact with the first die, the spacers helping to suspend the first die over a surface of an underlying structure such that there is a gap between the back surface of the first die and the surface of the structure, wherein the back surface of the first die is prevented from pressing directly against the surface of the structure;
• positioning a second die onto a second side of the leadframe opposite the first side of the leadframe such that I/O pads on the second die are positioned adjacent corresponding solder pads on second sides of the selected leads of the leadframe;
• and
• reflowing solder bumps positioned between the I/O pads on the second die and the solder pads on the second sides of the leads to produce a second plurality of solder joints that physically and electrically connect the second die to the leads of the leadframe, whereby the spacers support the leadframe such that during the second reflowing the first plurality of solder joints are not substantially compressed by the weight of the leadframe and wherein the first plurality of solder joints maintain sufficient structural integrity during the second reflowing such that the first die is carried by the first plurality of solder joints during the second reflowing without receiving additional support from any support structure that underlies and is in contact with the back surface of the first die.