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US 8,298,869 B2Granted
Resin package and production method thereof
AssigneeSumitomo Chemical Company, Limited
InventorsMitsuo Maeda, Yasuo Matsumi
Life of this patent
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Abstract
The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.
Claims7
A method for producing a resin package, comprising the steps of:
- (A) forming a copper oxide layer by oxidizing a surface of a lead frame in which at least the surface is made of copper,
- (B) forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution, and
- (C) forming a metallic layer in the predetermined area from which the copper oxide layer has been removed after step (B).
Dependencies are inferred from the claim text.