Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole

A method of making a semiconductor chip assembly, comprising:

• providing a post, a base, an adhesive and a substrate, wherein
• the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the substrate,
• the base covers the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions,
• the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified, and
• the substrate is mounted on and extends above the adhesive, wherein the substrate includes a conductive layer and a dielectric layer and the conductive layer extends above the dielectric layer;
• then
• flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate;
• solidifying the adhesive;
• then
• providing a plated through-hole that extends through the conductive layer, the dielectric layer, the adhesive and the base;
• then
• providing a conductive trace that includes a pad, a terminal and the plated through-hole, wherein the pad includes a selected portion of the conductive layer, the terminal includes a selected portion of the base that is spaced and separated from and no longer part of the base, the terminal has the same thickness as and is coplanar with the base and an electrically conductive path between the pad and the terminal includes the plated through-hole;
• providing a cap that is adjacent to and covers in the upward direction and extends laterally from a top of the post and that contacts and overlaps the adhesive and the dielectric layer and includes a selected portion of the conductive layer;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post, the base and the cap;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.

A method of making a semiconductor chip assembly, comprising:

• providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base covers the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions;
• providing an adhesive, wherein an opening extends through the adhesive;
• providing a substrate that includes a conductive layer and a dielectric layer, wherein an aperture extends through the substrate;
• mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening;
• mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the conductive layer extends above the dielectric layer, the post extends through the opening into the aperture and the adhesive is sandwiched between the base and the substrate and is non-solidified;
• then
• applying heat to melt the adhesive;
• moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the substrate;
• applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
• then
• providing a plated through-hole that extends through the conductive layer, the dielectric layer, the adhesive and the base;
• then
• providing a conductive trace that includes a pad, a terminal and the plated through-hole, wherein the pad includes a selected portion of the conductive layer, the terminal includes a selected portion of the base that is spaced and separated from and no longer part of the base, the terminal has the same thickness as and is coplanar with the base and an electrically conductive path between the pad and the terminal includes the plated through-hole;
• providing a cap that is adjacent to and covers in the upward direction and extends laterally from a top of the post and that contacts and overlaps the adhesive and the dielectric layer and includes a selected portion of the conductive layer;
• then
• mounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post, the base and the cap;
• electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal;
• and
• thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base.