Wafer level package and fabrication method
AssigneeAmkor Technology, Inc.
InventorsRonald Patrick Huemoeller, Sukianto Rusli, David Razu
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Abstract
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
Claims20
A method of forming an electronic component package comprising:
- forming an assembly, the assembly comprising:
- an electronic component comprising a first surface comprising bond pads thereon;
- an encapsulant encapsulating the entire electronic component except the first surface of the electronic component;
- and
- a dielectric strip comprising a first surface coupled to the first surface of the electronic component;
- forming via apertures through the dielectric strip to expose the bond pads subsequent to the forming an assembly;
- and
- filling the via apertures with an electrically conductive material to form vias electrically coupled to the bond pads, wherein excess electrically conductive material is formed on a second surface of the dielectric strip.
A method of forming an electronic component package comprising:
- encapsulating sides of an electronic component in an encapsulant, the electronic component comprising a first surface comprising bond pads thereon;
- coupling a first surface of a dielectric strip to the first surface of the electronic component;
- forming via apertures through the dielectric strip to expose the bond pads subsequent to the coupling a first surface of a dielectric strip;
- and
- forming vias and traces coupled to the dielectric strip, the vias being electrically coupled to the bond pads.
An electronic component package comprising:
- an encapsulant encapsulating sides of an electronic component, the electronic component comprising a first surface comprising bond pads thereon;
- a dielectric strip comprising a first surface coupled to the first surface of the electronic component;
- via apertures through the dielectric strip to expose the bond pads;
- and
- vias and traces coupled to the dielectric strip, the vias being electrically coupled to the bond pads, the vias completely filling the via apertures except that the vias are recessed below a second surface of the dielectric strip.
Dependencies are inferred from the claim text.