US 8,298,864 B2 · Manufacturing method for semiconductor device

Abstract

An improved manufacturing method for semiconductor devices is provided. This method can prevent chips and cracks from being generated when the rear face of the semiconductor substrate is polished. The manufacturing method includes preparing a semiconductor substrate having a front face and a rear face. The front face has an inner surface area and a peripheral surface area. Circuit elements are provided in the inner surface area of the semiconductor substrate. The manufacturing method also includes sealing the circuit elements with circuit sealing resin. The manufacturing method also includes providing cured resin in the peripheral surface area of the semiconductor substrate. The manufacturing method also includes polishing the rear face of the semiconductor substrate after the circuit sealing step. The manufacturing method also includes cutting the semiconductor substrate after the substrate polishing step so as to obtain semiconductor devices.

Claims20

Dependent claims

A manufacturing method for a semiconductor device, comprising:

a substrate preparation step of preparing a semiconductor substrate having a front face and a rear face, the front face having an inner surface area and a peripheral surface area, with circuit elements being provided in the inner surface area;
a circuit sealing step of sealing the circuit elements with circuit sealing resin such that the circuit sealing resin extends over the circuit elements;
a peripheral area resin formation step of providing cured resin in the peripheral surface area of the semiconductor substrate, said peripheral area resin formation step being carried out after said circuit sealing step;
a substrate polishing step of polishing the rear face of the semiconductor substrate after the circuit sealing step;
and
a substrate cutting step of cutting the semiconductor substrate after the substrate polishing step so as to obtain at least one semiconductor device.

3 more elements

A manufacturing method for a semiconductor device, comprising:

a substrate preparation step of preparing a semiconductor substrate having a front face and a rear face, the front face having an inner surface area and a peripheral surface area, with circuit elements being provided in the inner surface area;
providing conductive interconnects on the semiconductor substrate for connecting predetermined elements in the circuit elements with each other;
a circuit sealing step of sealing the circuit elements and the conductive interconnects with circuit sealing resin;
a peripheral area resin formation step of providing cured resin in the peripheral surface area of the semiconductor substrate, said peripheral area resin formation step being carried out after said circuit sealing step;
a substrate polishing step of polishing the rear face of the semiconductor substrate after the circuit sealing step;
and
a substrate cutting step of cutting the semiconductor substrate after the substrate polishing step so as to obtain at least one semiconductor device.

4 more elements

Dependencies are inferred from the claim text.

Manufacturing method for semiconductor device

Life of this patent

Manufacturing method for semiconductor device

Life of this patent

Abstract

Claims20