Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste

A method for forming a thick film pattern, comprising the steps of:

• applying to a support a photosensitive paste including a conductive powder, a photosensitive monomer, a photopolymerization initiator, and a polymer, wherein a ratio of the photosensitive monomer to a total amount of the photosensitive monomer and the polymer satisfies the condition represented by the following Formula:
• photosensitive monomer/(photosensitive monomer+polymer)≧0.90,
• so as to form a photosensitive paste film;
• subjecting the photosensitive paste film to an exposure treatment;
• and
• developing the photosensitive paste film subjected to the exposure treatment so as to form a thick film pattern;
• wherein
• the contents of the conductive powder, the photosensitive monomer, and the photopolymerization initiator are within the following ranges:
• conductive powder:
• about 60 to about 90 percent by weight of the photosensitive paste;
• photosensitive monomer:
• about 5 to about 39 percent by weight of the photosensitive paste;
• photopolymerization initiator:
• about 1 to about 10 percent by weight of the photosensitive paste;
• and
• the photosensetive paste includes a photosensitive monomer having a double bond concentration within the range of about 8 mmol/g to about 11 mmol/g.