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US 8,298,643 B2Granted
Method of manufacturing an optical data carrier
AssigneeSONY DADC Austria AG
InventorChristian Vogl
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an optical data carrier, wherein an essentially uncured resin layer is provided on a side of said optical data carrier. The essentially uncured resin layer is embossed with a relief pattern, wherein the relief pattern defines a graphic.
Claims4
An optical data carrier comprising:
- a resin layer with an embossed relief pattern, wherein said embossed relief pattern defines a graphic, a first level of molecular stress of said resin layer is below a second level of molecular stress that occurs when embossing a cured resin layer with a relief pattern, a further resin layer is sandwiched between said resin layer and a lower layer, said resin layer, said further resin layer, and said lower layer comprise a first, second, and third material, respectively, and a first adhesion force between said first and second material and a second adhesion force between said second and third material are larger than a third adhesion force between said first and third material.
An optical data carrier comprising:
- a resin layer with an embossed relief pattern, wherein said embossed relief pattern defines a graphic, a first level of molecular stress of said resin layer is below a second level of molecular stress that occurs when embossing a cured resin layer with a relief pattern under high pressure of 88.6 N/cm2 or more, a further resin layer is sandwiched between said resin layer and a lower layer, said resin layer, said further resin layer, and said lower layer comprises a first, second, and third material, respectively, and a first adhesion force between said first and second material and a second adhesion force between said second and third material are larger than a third adhesion force between said first and third material.
Dependencies are inferred from the claim text.