Process for inhibiting oxide formation on copper surfaces
AssigneeE. I. Du Pont de Nemours and Company
InventorJeffery Scott Thompson
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Abstract
This invention provides processes for inhibiting the formation of copper oxides on substantially oxide-free copper surfaces by contacting a substantially oxide-free copper surface with a bifunctional ligand that contains both a metal-coordinating group and a tertiary amine group in an aqueous solution of pH about 2 to about 5.5. A thin layer of the bifunctional ligand formed by coordination of the dialkylaminoacetonitrile to the copper surface can be removed by heating under vacuum to regenerate a substantially oxide-free copper surface.
Claims5
A process comprising contacting a substantially oxide-free copper surface with an aqueous solution comprising a bifunctional ligand for a sufficient period of time to form a copper surface coated with a layer of the bifunctional ligand, wherein the bifunctional ligand comprises a nitrile group and a tertiary amine group attached to a carbon atom adjacent to the nitrile group, and the pH of the solution is about 2 to about 5.5, and wherein the bifunctional ligand is dimethylaminoacetonitrile or diethylaminoacetonitrile.
Dependencies are inferred from the claim text.