Conductive paste, printed circuit board, and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKi-Hwan Kim, Jee-Soo Mok, Myung-Sam Kang
Life of this patent
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Abstract
A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.
Claims19
A conductive paste comprising:
- conductive particles;
- a polymer;
- a polymer foam, the polymer foam being formed in a shape of a cell and containing a foaming material that expands and creates foam when heated to a predetermined temperature, the conductive particles being coated on a surface of the polymer foam so as to form a metal layer of conductive particles coated on a surface of the polymer foam;
- and
- wherein a content of the conductive particles is 80 to 90 parts by weight per 100 parts by weight of the conductive paste, and a content of a mixture of the polymer and the polymer foam is 10 to 20 parts by weight per 100 parts by weight of the conductive paste.
A printed circuit board comprising:
- a plurality of substrates;
- an insulation layer placed between the substrates;
- a bump penetrating the insulation layer and interconnecting the substrates,
- wherein the bump is made from a conductive paste, the conductive paste comprising:
- conductive particles, a polymer, and a polymer foam the polymer foam being formed in a shape of a cell and containing a foaming material that expands and creates foam when heated to a predetermined temperature, the conductive particles being coated on a surface of the polymer foam so as to form a metal layer of conductive particles coated on a surface of the polymer foam;
- and
- wherein a content of the conductive particles is 80 to 90 parts by weight per 100 parts by weight of the conductive paste, and a content of a mixture of the polymer and the polymer foam is 10 to 20 parts by weight per 100 parts by weight of the conductive paste.
A method of manufacturing a printed circuit board, the printed circuit board comprising a first substrate and a second substrate stacked together with an insulation layer interposed in-between, and a bump penetrating the insulation layer to electrically connect the first substrate and the second substrate, the method comprising:
- forming the bump on one side of the first substrate by printing a conductive paste, the conductive paste comprising conductive particles, a polymer, and a polymer foam the polymer foam being formed in a shape of a cell and containing a foaming material that expands and creates foam when heated to a predetermined temperature, the conductive particles being coated on a surface of the polymer foam so as to form a metal layer of conductive particles coated on a surface of the polymer foam;
- expanding the bump;
- stacking the insulation layer on the one side of the first substrate;
- forming the second substrate on the insulation layer;
- and
- wherein a content of the conductive particles is 80 to 90 parts by weight per 100 parts by weight of the conductive paste, and a content of a mixture of the polymer and the polymer foam is 10 to 20 parts by weight per 100 parts by weight of the conductive paste.
Dependencies are inferred from the claim text.