Electroplating apparatus

A method for electroplating a rotogravure cylinder with copper out of a plating solution, the method comprising:

• providing an apparatus comprising a first tank adapted to receive the rotogravure cylinder and to contain the plating solution, a second tank coupled to the first tank such that plating solution may be transferred from the second tank to the first tank, and a non-dissolvable anode configured to be at least partially disposed within the plating solution;
• attaching metallic shields to the ends of the rotogravure cylinder;
• providing the plating solution comprising copper ions in the first tank;
• connecting the rotogravure cylinder to a current source;
• connecting the non-dissolvable anode to the current source;
• providing the non-dissolvable anode with a current of at least 1 ampere per square inch;
• providing the rotogravure cylinder in the first tank such that the rotogravure cylinder is at least partially disposed into the plating solution;
• plating copper on the rotogravure cylinder using the non-dissolvable anode in a rotogravure plating process;
• adding copper ions to the plating solution of the first tank during the rotogravure plating process using at least a source of copper ions not connected to an anode of the apparatus;
• and
• providing a hardener that increases the hardness of copper plated on the rotogravure cylinder.