Method and apparatus for plating metal parts

An apparatus for plating metal parts comprising:

• a metal rack containing a plurality of protruding spring fingers, each finger adapted to hold a part for plating under spring tension;
• a first electrode electrically connected to each of said spring fingers;
• a plurality of horizontal rotate bars positioned vertically along said rack, each of said rotate bars supporting a particular number of said spring fingers, wherein said rotate bars can rotate said protruding spring fingers from a first position pointing below horizontal to a second position pointing above horizontal;
• a depression bar mechanically coupled to said rotate bars through at least one return spring, said depression bar extending vertically above said rack, wherein when said depression bar is vertically depressed, said rotate bar rotates through an angle causing said spring fingers to move from said first position to said second position;
• a track above a plurality of plating tanks holding said metal rack such that said metal rack can move horizontally from tank to tank;
• a first roller attached to said track adapted to depress said depression bar when said rack encounters said roller as it moves;
• a plurality of second electrodes in at least some of said tanks;
• a second roller attached to said track;
• a stabilizer bar attached to said rack, wherein when said stabilizer bar encounters said second roller, the stabilizer bar provides a torque to counter any torque presented to said rack when said depression bar encounters said first roller.