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US 8,298,379 B2Granted
Method and apparatus for extending chamber component life in a substrate processing system
AssigneeTokyo Electron Limited
InventorJames A. McHugh
Life of this patent
Estimating the term…
Abstract
A chamber component for a substrate processing system is described. The chamber component comprises a primary member, and a deposit absorbing member coupled to the primary member, wherein the deposit absorbing member comprises a porous material configured to absorb material that is deposited on a surface thereof.
Claims27
A chamber component for a substrate processing system, comprising:
- a primary member including a deposition baffle configured to cover a dielectric window of the substrate processing system, the deposition baffle having openings configured to pass RF energy that enters a chamber through the dielectric window, said openings being configured to impede deposition material from passing therethrough and reaching the dielectric window, the deposition baffle having a baffle edge adjacent to a sputtering target;
- and
- a deposit absorbing member disposed to cover the baffle edge between the deposition baffle and the sputtering target, wherein said deposit absorbing member comprises a porous material configured to absorb material that is deposited on a surface thereof.
A sputtering system for depositing a thin film on a substrate, comprising:
- a dielectric window configured to permit RF energy therethrough;
- a sputtering target coupled to said sputtering system and configured to introduce a sputtered adatom to said sputtering system for deposition on said substrate;
- and
- a chamber component coupled to said sputtering system adjacent to said sputtering target, said chamber component comprising:
- a primary member including a deposition baffle provided over the dielectric window and having openings configured to pass the RF energy from the dielectric window while impeding deposition of material on the dielectric window, the deposition baffle being adjacent to the sputtering target at a baffle edge, and
- a deposit absorbing member disposed to cover the baffle edge between the deposition baffle and the sputtering target proximate to said sputtering target, wherein said deposit absorbing member comprises a porous material configured to absorb material that is deposited on a surface thereof.
3 more elements
A method of processing a substrate in a substrate processing system, the method comprising:
- disposing a chamber component including a deposition baffle within said substrate processing system, the deposition baffle being provided over a dielectric window and adjacent to a sputtering target at a baffle edge, wherein the deposition baffle having openings configured to pass RF energy from the dielectric window while impeding deposition of material on the dielectric window;
- coupling a deposit absorbing member to said chamber component to cover the baffle edge between the deposition baffle and the sputtering target, wherein said deposit absorbing member comprises a porous material configured to absorb material that is deposited on a surface thereof in said substrate processing system;
- providing a substrate in said substrate processing system;
- and
- processing said substrate.
2 more elements
Dependencies are inferred from the claim text.