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US 8,298,048 B2Granted
CMP pad dresser with oriented particles and associated methods
OwnerChien-Min Sunginventor
Life of this patent
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Abstract
CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear.
Claims13
A method for controlling CMP pad dresser performance in a CMP pad dresser as part of the pad dresser fabrication process, the pad dresser employing a plurality of superabrasive particles comprising:
- orienting the superabrasive particles into an attitude that provides an anticipated performance characteristic, wherein all superabrasive particles in a central location on the dresser are disposed in an attitude with an edge oriented toward a pad to be dressed, and all remaining superabrasive particles are disposed in an attitude whereby an edge is not oriented toward the pad, and wherein the attitudes of the superabrasive particles in the central location on the dresser are different from the attitudes of the remaining superabrasive particles.
A chemical mechanical polishing (CMP) pad dresser comprising:
- a substrate;
- and
- a plurality of superabrasive particles attached to the substrate, said particles being configured in an attitude that controls CMP pad dresser performance, wherein all superabrasive particles that are centrally located are disposed in an attitude with an edge oriented toward a pad to be dressed, and all remaining superabrasive particles are disposed in an attitude whereby an edge is not oriented toward the pad, and wherein the attitudes of the superabrasive particles in the central location on the dresser are different from the attitudes of the remaining superabrasive particles.
Dependencies are inferred from the claim text.