Back to results
US 8,298,042 B2Granted
Wire monitoring
AssigneeDeutsche Solar GmbH
InventorsJens Modler, Axel Kubin
Life of this patent
Estimating the term…
Abstract
A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermined path by means of the at least one guide device, and at least one monitoring device for monitoring the position of the at least one cutting element.
Claims14
A sawing for sawing silicon blocks, the sawing device comprising:
- at least one cutting element for sawing silicon blocks, said at least one cutting element being drivable by means of a drive device;
- at least one guide device, the at least one cutting element being alignable along a predetermined path by means of the at least one guide device;
- and
- at least one monitoring device for monitoring the position of the at least one cutting element, wherein the monitoring device comprises at least one index bar with guide plates arranged thereon.
1 more element
A sawing device for sawing silicon blocks, the sawing device comprising:
- a drive device;
- a cutting element for sawing silicon blocks, said at least one cutting element being driven via said drive device;
- a guide device, said cutting element being aligned with a predetermined path via said guide device;
- and
- a monitoring device for monitoring a position of said cutting element, said monitoring device comprising at least one index bar with guide plates arranged thereon.
2 more elements
Dependencies are inferred from the claim text.