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US 8,298,041 B2Granted
System and method for wafer back-grinding control
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Fa Lu, Chiang-Hao Lee, Wei-Yu Chen, Chung-Shi Liu
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Abstract
In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.
Claims10
A system for controlling wafer back-grinding, the system comprising:
- a chuck table having a surface for supporting a semiconductor wafer during a back-grinding process, wherein the chuck table has one or more holes defined in said surface;
- a back-grinding wheel configured to contact the semiconductor wafer;
- one or more sensors disposed in said one or more holes for monitoring a parameter during the back-grinding process;
- and
- a computer-implemented process control tool coupled to receive one or more outputs from the one or more sensors and control a position of the back-grinding wheel based on the received one or more outputs.
2 more elements
Dependencies are inferred from the claim text.