Integrated circuit socket

A method of manufacturing, comprising:

• providing a circuit board;
• forming socket on the circuit board, the socket having a surface and a peripheral wall for at least partially supporting a semiconductor chip package thereon, the semiconductor chip package having a central region, the surface of the socket having a mound projecting therefrom adapted to physically contact and provide support for the central region of the semiconductor chip package.

An apparatus, comprising:

• a package including a base substrate having a first side and a second side opposite the first side, the second side having a central region, a semiconductor chip coupled to the first side and a lid coupled to the first side;
• and
• a socket for receiving the base substrate, the socket including a mound projecting toward and adapted to physically contact the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate.