Slurry system for semiconductor fabrication
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chiang Tseng, Yung-Long Chen, Liang-Chieh Huang, Yi-Wen Huang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chiang Tseng, Yung-Long Chen, Liang-Chieh Huang, Yi-Wen Huang
Estimating the term…
A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.
A slurry feed system suitable for chemical mechanical planarization in a semiconductor fabrication facility, the system comprising:
Dependencies are inferred from the claim text.