Back to results
US 8,297,742 B2Granted
Bonded circuits and seals in a printing device
AssigneeFUJIFILM Corporation
InventorsKevin Von Essen, John A. Higginson, Andreas Bibl
Life of this patent
Estimating the term…
Abstract
A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.
Claims15
A fluid ejection device, comprising:
- a circuit layer having a fluid outlet on a lower surface;
- a chamber substrate having a fluid inlet on an upper surface;
- an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer;
- and
- a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate, wherein the seal and the electrical contact are a eutectic material.
2 more elements
A fluid ejection device, comprising:
- a fluid feed substrate having a fluid outlet on a lower surface;
- a chamber substrate having a fluid inlet on an upper surface;
- a seal forming a fluid connection between the fluid outlet of the fluid feed substrate and the fluid inlet of the chamber substrate, wherein the seal is a eutectic material formed of a first material and a second material;
- a stand-off bump between the fluid feed substrate and the chamber substrate, wherein the stand-off bump includes the first material, but does not include the second material.
1 more element
Dependencies are inferred from the claim text.