Bump forming method using self-assembling resin and a wall surface
AssigneePanasonic Corporation
InventorsSeiji Karashima, Yasushi Taniguchi, Seiichi Nakatani, Kenichi Hotehama, Takashi Kitae, Susumu Sawada
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Abstract
A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
Claims20
A method for forming bumps on a plurality of electrodes of a wiring board, comprising the steps of:
- (a) supplying a resin containing conductive particles and a gas bubble generating agent onto a first region so as to contiguously cover the plurality of electrodes on the wiring board;
- (b) then disposing a substrate having a wall surface perpendicular to a surface of the electrodes in direct contact with the wiring board and formed near a periphery of the electrodes so that the substrate faces the wiring board;
- (c) heating the resin to a temperature sufficient to generate gas bubbles from the gas bubble generating agent, the temperature being such that the conductive particles are not melted, to self-assemble the resin on the entire surfaces of the electrodes by the gas bubbles generated from the gas bubble generating agent;
- and
- after the step (c), (d) heating the resin at a temperature at which the conductive particles are melted to melt the conductive particles contained in the resin self-assembled on the electrodes, thereby forming the bumps on the entire surface opposite the wiring board of the electrodes.
Dependencies are inferred from the claim text.