Bump printing apparatus and method of controlling the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJoon Kon Kim
Life of this patent
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Abstract
There is provided a bump printing apparatus and a method of controlling the same that can increase the printability of solder bumps being printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and air nozzles provided within the printing table and providing air suction to bring the board into close contact with the printing table and spraying air to separate the mask from the board.
Claims5
A bump printing apparatus comprising:
- a printing table onto which a board is mounted;
- a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation;
- and
- air nozzles provided within the printing table and comprising a plurality of suction nozzles providing air suction to bring the board into close contact with the printing table and a plurality of spray nozzles spraying air to separate the mask from the board,
- wherein the suction nozzles are arranged along an upper surface of the printing table and the spray nozzles are arranged between the suction nozzles along an upper surface of the printing table, and
- wherein the board has air holes formed therethrough so that air being sprayed through the air nozzles passes through the board and moves upward from the board.
Dependencies are inferred from the claim text.