Polishing pad thickness measuring method and polishing pad thickness measuring device
AssigneeSumco Corporation
InventorsYuichi Nakayoshi, Hiroshi Takai, Hironori Nishimura
Life of this patent
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Abstract
A polishing pad thickness measuring method measures the thickness of a polishing pad attached to an upper surface of a surface plate. The polishing pad thickness measuring method measures a first distance between an upper surface of the polishing pad and a reference position on a vertical line perpendicular to the surface of the polishing pad and a second distance between an upper surface of the surface plate and the reference position on the vertical line, and calculates the thickness of the polishing pad from the difference between the first and second distances.
Claims20
A polishing pad thickness measuring method that measures a thickness of a polishing pad attached to an upper surface of a surface plate, the method comprising:
- measuring a first distance between an upper surface of the polishing pad and a reference position on a vertical line perpendicular to the surface of the polishing pad and a second distance between an upper surface of the surface plate and the reference position on the vertical line;
- and
- calculating the thickness of the polishing pad from a difference between the first and second distances.
A polishing pad thickness measuring method that measures a thickness of a polishing pad attached to an upper surface of a surface plate, the method comprising:
- measuring a first distance between an upper surface of the polishing pad and a reference position on a vertical line perpendicular to the surface of the polishing pad and a second distance between an upper surface of the surface plate and the reference position on the vertical line;
- and
- calculating the thickness of the polishing pad from a difference between the first and second distances,
- wherein distance measurement points of the first and second distances are set above reference planes having a predetermined flatness, respectively, and distances between the reference plane and the distance measurement points are calculated as correction amounts, and
- the reference position is positioned at a height obtained by subtracting the corresponding correction amount from the height of each of the distance measurement points.
A polishing pad thickness measuring device that measures a thickness of a polishing pad attached to an upper surface of a surface plate, the device comprising:
- a length measuring sensor which measures a first distance between an upper surface of the polishing pad and a reference position on a vertical line perpendicular to the surface of the polishing pad;
- a displacement sensor which measures a second distance between an upper surface of the surface plate and the reference position;
- a controller that is connected to the length measuring sensor and the displacement sensor and outputs signals for operating the length measuring sensor and the displacement sensor;
- and
- a calculator that is connected to the length measuring sensor and the displacement sensor and calculates the thickness of the polishing pad from a difference between the first and second distances.
A polishing pad thickness measuring device that measures a thickness of a polishing pad attached to an upper surface of a surface plate, the device comprising:
- a length measuring sensor which measures a first distance between an upper surface of the polishing pad and a reference position on a vertical line perpendicular to the surface of the polishing pad;
- a displacement sensor which measures a second distance between an upper surface of the surface plate and the reference position;
- a controller that is connected to the length measuring sensor and the displacement sensor and outputs signals for operating the length measuring sensor and the displacement sensor;
- and
- a calculator that is connected to the length measuring sensor and the displacement sensor and calculates the thickness of the polishing pad from a difference between the first and second distances,
- wherein distance measurement points of the first and second distances are set above reference planes having a predetermined flatness, respectively, and distances between the reference plane and the distance measurement points are calculated as correction amounts, and
- the reference position is positioned at a height obtained by subtracting the corresponding correction amount from the height of each of the distance measurement points.
Dependencies are inferred from the claim text.