Method for manufacturing a printed circuit board

A method for manufacturing a printed circuit board, comprising:

• providing a base board including a first surface layer;
• performing a first patterning process to the base board to form a bottom circuit on the first surface layer;
• forming a metal protection layer on the bottom circuit;
• performing a second patterning process to the metal protection layer to form a patterned metal protection layer;
• performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer;
• performing a third patterning process to the first built-up layer to form a first built-up layer circuit;
• performing a laser manufacturing process to the first built-up layer to form a cavity structure with the bottom circuit disposal therein, wherein the bottom circuit has a top end formed in an arc shape;
• and
• clearing the patterned metal protection layer.