Process for preparing a heatsink system and heatsink system obtainable by said process

A process for preparing a heatsink system for a heat generating electronic device, comprising the steps of:

• (a) providing a heat conducting substrate;
• (b) applying a thermoset powder polymer based binder material insulating layer on the heat conducting substrate;
• and
• (c) applying a printed circuit directly on the thermoset powder polymer based binder material insulating layer by means of a hot embossing system,
• wherein step (c) comprises:
• treating a first side of a copper foil to provide a fine voided structure;
• providing the treated copper foil on the insulating layer;
• stamping at least a portion of the copper foil on the insulating layer with a heated embossing tool,
• wherein the insulating layer flows into the fine voided structure of the copper foil to provide adhesion between the copper foil and the insulating layer, and
• removing residual copper which was not stamped on the insulating layer.