Conformal shielding employing segment buildup

A method of manufacturing a module comprising:

• providing a substrate;
• providing a first component area and a second component area and a third component area on the substrate, wherein the third component area separates the first component area from the second component area;
• providing a first peripheral metallic structure on a top surface of the substrate, wherein the first peripheral metallic structure is peripheral to and substantially surrounds the first component area;
• providing a second peripheral metallic structure on the top surface of the substrate, wherein the second peripheral metallic structure is peripheral to and substantially surrounds the second component area, and wherein the second peripheral metallic structure is electrically isolate from the first peripheral metallic structure;
• providing a body over:
• the first component area, the second component area, the third component area, the first peripheral metallic structure, and the second peripheral metallic structure, wherein the body is a dielectric material;
• creating orifices in the body exposing portions of the first peripheral metallic structure and portions of the second peripheral metallic structure;
• providing a first electromagnetic shield material covering the body over the first component area and electrically contacting the first peripheral metallic structure;
• providing a second electromagnetic shield material covering the body over the second component area and electrically contacting the second peripheral metallic structure;
• wherein the body over the third component area is at least partially not covered by any electromagnetic shield material, such that the first electromagnetic shield material is electrically isolated from the second electromagnetic shield material.