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US 8,296,940 B2Granted
Method of forming a micro pin hybrid interconnect array
AssigneeGeneral Electric Company
InventorsCharles Gerard Woychik, John Eric Tkaczyk, Brian David Yanoff, Tan Zhang
Life of this patent
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Abstract
A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.
Claims11
A method of forming a micro pin hybrid interconnect array, the method comprising:
- providing a crystal anode array and a ceramic substrate, the crystal anode array comprising a single substantially planar unitary solderable under bump metallization (UBM) layer;
- and
- joining together the array and substrate via a compliant micro pin hybrid interconnect configuration that reduces local strain in each region where the array and substrate are joined together, such that mechanical strains during temperature excursions remain below that achieved using solder bonding to join a crystal anode array to an interconnect to form a micro pin hybrid interconnect array.
Dependencies are inferred from the claim text.