Mounting method using dilatancy fluid
AssigneeSony Chemical & Information Device Corporation
InventorKazutaka Furuta
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Chemical & Information Device Corporation
InventorKazutaka Furuta
Estimating the term…
Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device 100 includes a lower pressurizing section 102 as a first pressurizing section and an upper pressurizing section 104 as a second pressurizing section, and pressurizes a substrate, a plurality of electronic components, and the like, sandwiched between the lower pressurizing section 102 and the upper pressurizing section 104, thereby mounting the substrate to the plurality of electronic components. The lower pressurizing section 102 or the upper pressurizing section 104 includes a dilatancy fluid 116.
A mounting method, comprising:
A mounting method, comprising:
Dependencies are inferred from the claim text.