Wafer positioning system

An assembler for constructing a pagewidth inkjet printhead by assembling a plurality of inkjet printhead integrated circuits (ICs) on a carrier, said assembler comprising:

• a support assembly operatively supporting a diced wafer, said diced wafer including the printhead ICs;
• a wafer positioning assembly for positioning the diced wafer;
• a die picking assembly for picking the printhead ICs from said wafer;
• a die placement assembly for placing the printhead ICs onto the carrier such that a predetermined plurality of printhead ICs are sequentially positioned across the carrier so as to construct said pagewidth inkjet printhead, wherein the carrier defines a plurality of tortuous ink paths for supplying ink to fluid inlets in each printhead IC;
• a die conveyance mechanism for operatively conveying the printhead ICs from the die picking and placement assemblies;
• a clamp assembly comprising:
• an elongate clamp body shaped and configured to be received by the die placement assembly;
• a pair of elongate retaining plates mounted on top of the body;
• an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier;
• and
• a diaphragm positioned in the body, the diaphragm being pneumatically displaceable to operatively urge the insert against the retaining plates;
• and
• a control system controlling the assembler,
• wherein said wafer positioning assembly comprises:
• a displacement assembly having a base plate, the base plate having first and second stages mounted thereon;
• and
• a wafer support plate assembly rotatably mounted on the second stage, the support plate assembly configured to receive the wafer and having a motor under control of the control system to rotate the support plate assembly underneath the die picking assembly.