Materials-based failure analysis in design of electronic devices
AssigneeVextec Corporation
InventorsRobert G. Tryon, III, Animesh Dey, Loren A. Nasser, Ganapathi Krishnan
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Abstract
The technology includes methods, a system, and a computer readable medium for predicting the failure of an electronic device during design of the device, by receiving data associated with the device, the data including data indicative of a device response to a specific load on the system while the device is in operation, and predicting potential failure of the device using a probabilistic model and the data, wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques.
Claims21
A computer-implemented method for using a prediction of failure of an electronic device during design of the device, the method comprising:
- receiving data associated with a metallic component in the device, the data including data indicative of a response of the component to a specific load on the component while the device is in operation;
- and
- calculating a prediction indicative of a potential failure of the device using a probabilistic model of failure of the component, wherein the probabilistic model is based on at least the specific load, and a microstructure-based failure model and the data, and wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and includes one or more of a crack nucleation model and a short crack growth model.
A computer system, configured to use a prediction of failure of an electronic device during design of the device, the system comprising:
- a processor;
- and
- a memory, wherein the processor is configured to execute instructions for:
- receiving data associated with a metallic component in the device, the data including data indicative of a response of the component to a specific load on the component while the device is in operation;
- and
- calculating a prediction indicative of a potential failure of the device using a probabilistic model of failure of the component, wherein the probabilistic model is based on at least the specific load, and a microstructure-based failure model and the data, and wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and includes one or more of a crack nucleation model and a short crack growth model.
A computer readable non-transitory medium, configured with instructions for using a prediction of failure of an electronic device during design of the device, the instructions comprising instructions for:
- receiving data associated with a metallic component in the device, the data including data indicative of a response of the component to a specific load on the component while the device is in operation;
- and
- calculating a prediction indicative of a potential failure of the device using a probabilistic model of failure of the component, wherein the probabilistic model is based on at least the specific load, and a microstructure-based failure model and the data, and wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and includes one or more of a crack nucleation model and a short crack growth model.
Dependencies are inferred from the claim text.