Electronics package suitable for implantation
AssigneeSecond Sight Medical Products, Inc.
InventorsRobert J. Greenberg, Jerry Ok
Life of this patent
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Abstract
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
Claims14
An implantable device comprising:
- a first substrate forming part of a rigid hermetic package, containing a first electrically conductive pad on a first side of said first substrate electrically connected to hermetic vias through the first substrate;
- a first flexible electrically insulating layer on said first side of said substrate;
- a flexible electrically conducting layer on said first flexible electrically insulating layer wherein at least a portion of said flexible electrically conducting layer electrically contacts said first conductive pad;
- a second flexible electrically insulating layer on said flexible electrically conducting layer and said first flexible electrically insulating layer;
- a second substrate containing a second conductive pad on a first side of said second substrate,
- wherein the second conductive pad electrically contacts at least a portion of said flexible electrically conducting layer.
Dependencies are inferred from the claim text.