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US 8,285,379 B2Granted
Electrical interconnection structures and method
AssigneeMedtronic, Inc.
InventorsRajesh V. Iyer, William J. Taylor, Joseph F. Lessar, Mark D. Breyen, Daniel J. Koch
Life of this patent
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Abstract
An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.
Claims7
An electrical interconnect structure for an implantable medical device, the interconnect structure comprising:
- a feedthrough having a pin extending from the feedthrough, the pin structure defining a first end, a second end, and a middle portion, wherein the middle portion of the pin has a first cross-sectional area;
- a bonding surface at the first end of the pin and a bonding surface at the second end of the pin, wherein each bonding surface has a surface area greater than the first cross-sectional area of the pin;
- and
- a first wire that is electrically connected to the bonding surface and a second wire directly welded to the first wire in an end-to-end configuration.
1 more element
Dependencies are inferred from the claim text.