Electronic substrate
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
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Abstract
The electronic substrate includes: a substrate having a first face on which an active element is formed, and a second face on an opposite side to the first face and on which a passive element is formed; and an insulating layer including insulating resin and provided on the substrate, wherein the passive element is formed on the insulating layer, and further comprising: an interconnection pattern arranged on or above the second face of the substrate, wherein the passive element is configured from one part of the interconnection pattern, and a resin layer provided on the second face of the substrate, wherein at least one part of the passive element is formed on the resin layer.
Claims19
An electronic substrate comprising:
- a substrate having
- a first face on which an active element is formed, and
- a second face on an opposite side to the first face and on which a passive element is formed;
- and
- an insulating layer including insulating resin and provided on the substrate, wherein
- the passive element is formed on the insulating layer, and
- further comprising:
- an interconnection pattern arranged on or above the second face of the substrate, wherein the passive element is configured from one part of the interconnection pattern, and
- a resin layer provided on the second face of the substrate, wherein at least one part of the passive element is formed on the resin layer.
Dependencies are inferred from the claim text.