Methods of fabricating MEMS with spacers between plates and devices formed by same
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsJeffrey Brian Sampsell, Brian James Gally, Philip Don Floyd
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AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsJeffrey Brian Sampsell, Brian James Gally, Philip Don Floyd
Estimating the term…
Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
A microelectromechanical system (MEMS) device, comprising:
A method of making a microelectromechanical system (MEMS) device, the method comprising:
A method of making a microelectromechanical system (MEMS) device, the method comprising:
A method of making a microelectromechanical system (MEMS) device, the method comprising:
A method of making a microelectromechanical system (MEMS) device, the method comprising:
Dependencies are inferred from the claim text.