Wafer surface measuring apparatus
AssigneeSumco Corporation
InventorsEiji Kamiyama, Etsurou Morita
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Abstract
A wafer surface measuring apparatus which measures a surface of the wafer by irradiating a laser beam on a wafer comprising a measuring stage that supports the outer edge of the wafer and loads the wafer in a manner not contacting the rear surface of the wafer and the stage surface, a wafer carrying means that moves the wafer over the measuring stage and loads the wafer on the measuring stage from an upward side, a rotary drive unit which rotates the measuring stage, and an ejection hole formed at a center portion of the stage surface to supply gas to a rear surface of the wafer loaded on the measuring stage. The wafer carrying means includes a chuck which sucks and holds the surface of the wafer in a non-contact manner and bends the wafer in an upwardly convex shape.
Claims10
A wafer surface measuring apparatus which measures a surface of the wafer by irradiating a laser beam on a wafer comprising:
- a measuring stage that supports an outer edge of the wafer and loads the wafer in a manner not contacting with a rear surface of the wafer and a stage surface;
- a wafer carrying means that moves the wafer over the measuring stage and loads the wafer on the measuring stage from an upward side;
- a rotary drive unit which rotates the measuring stage;
- and
- an ejection hole formed at a center portion of the stage surface to supply gas to a rear surface of the wafer loaded on the measuring stage,
- wherein the wafer carrying means includes a chuck which sucks and holds the surface of the wafer in a non-contact manner and bends the wafer in an upwardly convex shape.
Dependencies are inferred from the claim text.