Probe device, processing device, and probe testing method

A processing device which is connected to a probe device to which connected are a plurality of probe cards for inspecting semiconductor wafers and a test device for performing the inspection, comprising:

• a storage portion for storing a first identifier for identifying the plurality of probe cards and a second identifier for identifying a plurality of measuring stages connected to corresponding ones of the plurality of probe cards;
• a first receiving portion for receiving a first inspection result, including the first identifier for identifying the plurality of probe cards, from at least one of the probe device or the test device;
• a first judgment portion for judging the use/nonuse of the probe cards according to the first inspection result;
• a transmission portion for transmitting information indicating at least one of the probe cards judged as nonuse or the measuring stages corresponded with the probe cards to the probe device;
• a second receiving portion for receiving a second inspection result, including the first identifier for identifying the plurality of probe cards, from at least one of the probe device or the test device;
• and
• a second judgment portion for determination or release of the judgment of nonuse on at least one of the probe cards or the measuring stages according to the first and second inspection results.

A probe testing method for inspecting a semiconductor wafer, comprising:

• reading from a plurality of probe cards a first identifier for identifying the plurality of probe cards for inspecting the semiconductor wafer;
• reading a second identifier for identifying a plurality of measuring stages, to which the plurality of probe cards are connected respectively, from a first storing unit which stores the second identifier;
• storing the read first and second identifiers in correspondence with each other into a second storing unit;
• conveying the semiconductor wafer to a first measuring stage to which a first probe card is connected;
• inspecting the semiconductor wafer by the first probe card to obtain a first inspection result;
• judging use/nonuse of a probe card according to the first inspection result;
• conveying the semiconductor wafer to a second measuring stage to which connected is a second probe card different from the probe card judged as nonuse;
• and
• inspecting the semiconductor wafer by the second probe card to obtain a second inspection result.