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US 8,283,859 B2Granted
Light emitting device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorSeiko Amano
Life of this patent
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Abstract
It is an object of the present invention to prevent an insulating film from peeling in a section where the insulating film is adjacent to a sealing region. Over a first substrate 104, a pixel portion 100 provided with a light emitting element, a source driver 101, a gate driver 102, and a sealing region 103 are provided. A light emitting element is sealed between the first substrate 104 and a second substrate 110 by a sealant 108. An insulating film 107 serves as a partition wall of the light emitting element. An end portion of the insulating film 107 which is adjacent to the sealing region 103 does not overlap with a step formed by a side surface and an upper surface of a conductive film 106 which serves as a wiring.
Claims28
A light emitting device comprising:
- a first substrate including a pixel portion and a sealing region;
- a sealant formed in the sealing region which surrounds the pixel portion;
- a second substrate fixed to the first substrate by the sealant;
- a transistor formed over the first substrate;
- a first insulating film formed over the transistor;
- a conductive film formed over the first insulating film;
- a second insulating film formed over the conductive film and the first insulating film;
- and
- a third insulating film formed over the conductive film and the first insulating film with the second insulating film interposed therebetween,
- wherein the pixel portion comprises a light emitting element,
- wherein the sealant is in contact with the second insulating film and a side surface of the third insulating film, and
- wherein a driver circuit and the sealant overlap with each other.
9 more elements
A light emitting device comprising:
- a first substrate including a pixel portion and a sealing region;
- a sealant formed in the sealing region which surrounds the pixel portion;
- a second substrate fixed to the first substrate by the sealant;
- a transistor formed over the first substrate;
- a first insulating film formed over the transistor;
- a conductive film formed over the first insulating film;
- a second insulating film formed over the conductive film and the first insulating film;
- and
- a filler material in contact with a side surface of the sealant,
- wherein the pixel portion comprises a light emitting element,
- wherein the second insulating film is formed of inorganic material,
- wherein an end portion of the second insulating film is in contact with the sealant,
- wherein a top edge of the second insulating film is covered with the sealant,
- wherein the end portion of the second insulating film does not overlap with a step formed by the side surface and an upper surface of the conductive film, and
- wherein a driver circuit and the sealant overlap with each other.
12 more elements
A light emitting device comprising:
- a first substrate including a pixel portion and a sealing region;
- a sealant formed in the sealing region which surrounds the pixel portion;
- a second substrate fixed to the first substrate by the sealant;
- a first insulating film formed over the first substrate;
- a first conductive film formed over the first insulating film;
- a second conductive film formed over the first insulating film;
- a second insulating film formed over the first conductive film, the second conductive film, and the first insulating film;
- and
- a third insulating film formed over the first conductive film, the second conductive film, and the first insulating film with the second insulating film interposed therebetween,
- wherein the pixel portion comprises a light emitting element,
- wherein the sealant is in contact with the second insulating film and a side surface of the third insulating film,
- wherein the sealant overlaps with the second conductive film, and
- wherein a driver circuit and the sealant overlap with each other.
10 more elements
A light emitting device comprising:
- a first substrate including a pixel portion and a sealing region;
- a sealant formed in the sealing region which surrounds the pixel portion;
- a second substrate fixed to the first substrate by the sealant;
- a first insulating film formed over the first substrate;
- a first conductive film formed over the first insulating film;
- a second conductive film formed over the first insulating film;
- a second insulating film formed over the first conductive film, the second conductive film, and the first insulating film;
- and
- wherein the pixel portion comprises a light emitting element,
- wherein an end portion of the second insulating film is in contact with the sealant,
- wherein a top edge of the second insulating film is covered with the sealant, and
- wherein the end portion of the second insulating film does not overlap with a step formed by a side surface and an upper surface of the first conductive film,
- wherein the sealant is in contact with the second conductive film, and
- wherein a driver circuit and the sealant overlap with each other.
11 more elements
Dependencies are inferred from the claim text.